Humanoid Robotics and AI in Manufacturing
Covers developments in humanoid robotics, AI integration in industrial and manufacturing contexts, and related government policies or industry projections.
All Articles
QCraft Unveils 500TOPS Physical AI Solution
At the 2026 Beijing Auto Show, QCraft announced a strategic pivot from autonomous driving to general-purpose physical AI, launching its 500TOPS Chengfeng MAX platform that enables efficient urban NOA through world models and reinforcement learning—prioritizing real-world user experience over raw compute power.
SiEngine Unveils 5nm In-Cabin and Driving Fusion Chip 'Dragon Eagle II'
SiEngine Technology has launched the 'Dragon Eagle II', a 5nm automotive-grade AI fusion chip delivering 200 TOPS and support for 7B+ parameter large models. Set for adaptation in Q1 2027, it targets central computing platforms across all vehicle tiers and features breakthroughs in performance, memory bandwidth, and functional safety.
A2MAC1 Proposes a New Paradigm for R&D
At the 2026 Beijing Auto Show, A2MAC1 announced a strategic shift in vehicle benchmarking—moving it from late-stage analysis to the product planning phase. Leveraging AI and data, the company aims to transform engineering decisions and respond to China’s intensifying EV competition.
JAC Unveils Industry's First CV Quality Inspection Large Model
At the Beijing Auto Show, JAC Group introduced MaiSite—a 3-billion-parameter computer vision AI model revolutionizing vehicle quality inspection with millisecond inference, cross-model reuse, and 100% traceability. Backed by 5,000+ R&D experts and partnerships with Tsinghua University, JAC reinforces its leadership in premium EV manufacturing.
Lenovo Launches NVIDIA Thor-Based Cockpit and Driving AI Computing Platform
Lenovo Vehicle Computing introduced the Auto AI Box at the 2026 Beijing Auto Show—an integrated AI platform powered by NVIDIA DRIVE Thor that unifies autonomous driving and intelligent cabin systems. Designed for L2+ to L4 vehicles, it leverages generative AI to enable proactive, personalized in-car experiences.
ChipON Unveils Embodied Intelligence Chip Matrix
At the 2026 Beijing Auto Show, ChipON revealed its upgraded Strategy 2.0, introducing the AMU Intelligent Control Platform, X10 AI cockpit SoC, and a new chip matrix targeting centralized computing for next-gen EVs and embodied intelligent systems.
Smart Vehicle Supply-Demand Matching Event to Be Held on April 27
The CheBaiHui Research Institute hosts a key industry event on April 27 in Beijing, aligning smart vehicle technologies—like AI models and advanced chips—with real-world automotive applications. Part of the Zhongguancun Forum, the conference aims to overcome integration bottlenecks and fast-track ecosystem development.
MIIT Releases Q1 Industrial Operation Data
China’s Ministry of Industry and Information Technology (MIIT) reported robust industrial growth in Q1 2026, with industrial added value up 6.1% year-on-year. Equipment manufacturing—including EVs and high-tech sectors like robotics and semiconductors—drove nearly half of total growth, supported by rising manufacturing investment and proactive policy measures.
Intelligent Vehicle Supply-Demand Matching Conference to Be Held on April 27
The Intelligent Vehicle Scenario Promotion and Supply-Demand Matching Conference takes place in Beijing on April 27, aiming to connect cutting-edge technologies—such as large AI models, high-compute chips, and advanced sensors—with practical automotive applications. Organized by China EV100 and partners, the event fosters ecosystem collaboration to overcome standardization and integration challenges.
Hesai Launches Four New Products to Enter Physical AI Infrastructure
At its 2026 Technology Open Day, Hesai Technologies introduced four groundbreaking products, shifting from spatial perception to spatial intelligence. The launch includes the world’s first 6D full-color SPAD-SoC chip 'Picasso,' high-resolution ETX LiDAR, Kosmo AI hardware, and a robotic power module—positioning Hesai as a foundational enabler of physical-world AI.
Hesai Launches World's First 6D Full-Color LiDAR Platform
Hesai Technology has introduced the industry’s first 6D full-color LiDAR platform, powered by its proprietary Picasso SPAD-SoC chip, delivering 4,320-line resolution, 600-meter range, and advanced noise filtering. The platform marks Hesai’s strategic move from spatial perception to spatial intelligence, supported by new AI hardware Kosmo and a robotic power module. Mass production is slated for H2 2026.
Desay SV Officially Launches Hong Kong IPO to Accelerate Global Expansion in EV Tech and Robotics
Despite a strong cash position, Desay SV has launched its Hong Kong IPO to establish a global capital platform, supporting expansion in smart cockpits, intelligent driving, and new ventures like low-speed autonomous vehicles and robotics. The company reported RMB 32.56B in 2025 revenue, with over RMB 33B in combined annualized orders from core segments.