SiEngine Unveils 5nm In-Cabin and Driving Fusion Chip 'Dragon Eagle II'

[Technology Launch] SiEngine Technology unveiled the 5nm automotive-grade AI in-cabin and driving fusion chip 'Dragon Eagle II' at the Beijing Auto Show.

Core Development: 'Dragon Eagle II' Adaptation to Begin in Q1 2027

The 'Dragon Eagle II' is built on a 5nm process node, delivering 200 TOPS of AI computing power and native support for multi-modal large models exceeding 7B parameters. Adaptation is scheduled to commence in Q1 2027, targeting central computing platforms ranging from entry-level to flagship tiers.

Key Specifications: Dual Breakthroughs in Performance and Safety

The chip integrates a 360K DMIPS multi-core CPU, a 2800 GFLOPS GPU, and offers memory bandwidth up to 518 GB/s, supporting LPDDR6/5X/5. Through physically isolated design and an independent redundant architecture, it ensures stable operation of intelligent driving functions even under high cabin workloads.

Strategic Foundation: Expanding from Automotive Chips to On-Device Intelligence

Starting with the 'Dragon Eagle I', SiEngine has now expanded into fields such as industrial intelligence and embodied intelligence. The company has established strategic partnerships with WeRide, Yutong Group, and ShouChuan Microelectronics to accelerate mass production of in-cabin and driving fusion solutions and their deployment in commercial vehicles.