Silan Integrated Launches Phase IV Project with RMB 20 Billion Investment

[Capacity Investment] Silan Integrated plans to build a 12-inch wafer fabrication line with a monthly capacity of 50,000 wafers, representing a total investment of approximately RMB 20 billion.

Core Strategic Move: RMB 20 Billion Boost for Dual Tracks in AI and Automotive-Grade Chips

Silan Integrated will contribute RMB 3.012 billion (holding a 25.1% stake) to jointly establish the Phase IV project in Shaoxing, focusing on new energy vehicles and industrial control, while expanding into AI server power management and optical interconnect markets.

Key Metrics: Five Process Platforms Targeting High-Growth Segments

The project will deploy platforms covering 55nm to 28nm automotive-grade MCUs and AI edge DSPs, 90nm high-performance BCD, 55nm AI power management, 55nm silicon photonics chips, and 55nm SiGe optical engine technologies, targeting demand from intelligent vehicles, AIoT, and data centers.

Strategic Foundation: Shifting from Capacity Expansion to Technological Depth

Upon completion of Phase IV, the company’s total wafer production capacity will exceed 400,000 wafers per month (equivalent to 8-inch), strengthening its position as a leading domestic manufacturer of power and analog chips and enabling entry into the global AI computing infrastructure supply chain.