Ouye Semiconductor Completes Hundreds of Millions of RMB Series C Financing

[Financing Update] Ouye Semiconductor has completed a Series C financing round worth hundreds of millions of RMB to accelerate its 'Everything+AI' strategic layout.

Core Development: Hundreds of Millions of RMB in Series C Funding to Strengthen Mass Production Capability for Edge AI Chips

This round was jointly participated by SDIC Capital, Shenzhen’s “20+8” New Energy Vehicle Fund, Nanshan Strategic Emerging Industries Investment, and BinFu Capital. The proceeds will be used for technology R&D, product mass production, and expansion across multiple industries.

Key Metrics: Dozens of Design Wins Spanning Smart Automotive and Robotics

The company has launched AI chip series including Longquan, Gongbu, and Chunjun. In the smart automotive sector, it has secured design wins with multiple leading automakers, with products progressively entering vehicle production; in smart industrial and robotics applications, its chips support real-time computing demands for embodied robots and industrial vision systems.

Strategic Foundation: Unified Architecture Enables Cross-Scenario Deployment

Leveraging a unified algorithm, chip, and software stack, Ouye Semiconductor is naturally extending from smart automotive into broad AIoT and intelligent manufacturing, reinforcing the foundational infrastructure for physical-world intelligence.