SiEngine Unveils LongEagle II AI Cockpit Chip with 200 TOPS and Native Large Model Support

[Technical Breakthrough] At the 2026 Beijing Auto Show, SiEngine Technology launched the 5nm automotive-grade AI cockpit chip "LongEagle II" (SE2000).

Core Strategic Shift: From Automotive SoC to On-Device Intelligent Computing Platform

Dr. Wang Kai explained that the LongEagle II supports full-scenario applications for AI cockpits and integrated cabin-and-driving systems, featuring a flexible architecture that can be readily adapted to OEMs’ central computing platforms—from entry-level to flagship models.

Key Specifications: 200 TOPS AI Performance with Native Large Model Support

The chip integrates 200 TOPS of AI computing power and natively supports 7B+ multimodal large models. It is equipped with a multi-core CPU (360K DMIPS), GPU (2800 GFLOPS), and offers memory bandwidth up to 518 GB/s, compatible with LPDDR6/5x/5.

Strategic Foundation: Mass Production Experience Driving Platform Positioning

Leveraging its experience in mass-producing millions of cockpit SoCs, SiEngine adheres to a strategy of comprehensive coverage and platform compatibility, securing an early position in future central computing architectures.