Beidou Zhilian and Unisoc Join Forces to Build an Intelligent Cockpit Ecosystem

[Strategic Partnership] Beidou Zhilian and Unisoc have signed an agreement to jointly promote a 'chip-driven' intelligent cockpit ecosystem.

Core Initiative: Focusing on Synergy Between SoC Platforms and Communication Technologies

The two parties will deepen collaboration across three key dimensions—technology R&D, market expansion, and ecosystem co-construction—leveraging next-generation intelligent cockpit SoC platforms and advanced communication technologies to accelerate the localization and high-quality development of China's intelligent cockpit industry chain.

Strategic Foundation: A Critical Step Forward for Domestic 'Chip-Cockpit Integration'

During the Beijing Auto Show 2026, Li Guanqun, Vice President of Beidou Zhilian, and Huang Yuning, Executive Vice President of Unisoc, jointly witnessed the signing ceremony. Prior to this, the two companies had already validated their collaborative capabilities through the A7870 platform mass-production定点 (定点 translated as 'design win' in industry context), marking substantial progress in the deep integration of domestically developed chips with cockpit systems.